Thermal technique for determining interface and/or interply stre

Details Thermal technique for determining interface and/or interply stre Thermal technique for determining interface and/or interply stre

1989-09-20

1990-11-27

Raevis, Robert

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

374 57, G01N 2904

Patent

active

049727206

ABSTRACT:
A method and apparatus for characterizing bonding properties in compositions which utilizes thermal energy to cause controlled debonding of interface and/or interply bonds. Debonding events resulting from the controlled debonding are detected and utilized to characterize the interface and/or interply properties of the composition.

REFERENCES:
patent: 4004456 (1977-01-01), Vahaviomos
patent: 4024522 (1977-05-01), Clark
patent: 4543486 (1985-09-01), Rose
Webster's II New Riverside University Dictionary 1988, Houghton Mifflin Cany (pp. 342, 874).

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