Thermal structure for electric devices

Details Thermal structure for electric devices Thermal structure for electric devices

2007-07-17

2007-07-17

Nasri, Javaid H. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S104330, C165S080400, C165S104260, C257S715000, C174S015200, C361S695000

Reexamination Certificate

active

11285028

ABSTRACT:
A thermal module includes a thermal body, at least one thermal tube, and a holding part. The thermal tube includes a heat receiving portion and condenser terminals connecting with the thermal body, wherein the heat receiving portion has a plane. The holding part includes a plate body with trenches therein, wherein the trenches has through holes and a connecting part formed between the through holes. The through holes are used for receiving and holding the heat receiving portion of the thermal tube. The connecting part are connected with a top surface of the heat receiving portion. Thus, thermal transfer is speed up, and the thermal module is assembled without a thermal treatment which causing a copper reduction reaction, resulting in improvement of thermal conduction, reduction of cost, and manufacturing time saving.

REFERENCES:
patent: 6830098 (2004-12-01), Todd et al.
patent: 7028758 (2006-04-01), Sheng et al.
patent: 2006/0144572 (2006-07-01), Yu et al.

Affiliated with

Also associated with

Rating

Thermal structure for electric devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal structure for electric devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal structure for electric devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3806997