Thermal stress relieving bimetallic plate

Details Thermal stress relieving bimetallic plate Thermal stress relieving bimetallic plate

1980-11-21

1984-01-24

Edlow, Martin H.

357 67, H01L 2302

Patent

active

044279930

ABSTRACT:
A thermal matching element which exhibits high electrical conductivity and high thermal conductivity is used to join a heat generating semiconductor device with a heat transmissive electrically conductive members. The thermal matching element is independently selected for different directions in the plane of the matching surface.

REFERENCES:
patent: 3296501 (1967-01-01), Moore
patent: 3399332 (1968-08-01), Savolainen
patent: 4320412 (1982-03-01), Hynes et al.

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