Thermal stencil master plate and method for processing the same

Details Thermal stencil master plate and method for processing the same Thermal stencil master plate and method for processing the same

1995-01-04

1996-06-04

Bennett, Christopher A.

Printing

Stenciling

Stencils

101129, B41C 114

Patent

active

055223133

ABSTRACT:
In the thermal stencil master plate and the method for processing the stencil master plate according to the present invention, since swelled and solidified unprocessed regions formed by film lumps or a part thereof produced from the melted film are provided continuously, the merging and excessive expansion of the perforations can be avoided so that clear printed picture images may be formed even in the regions of solid picture images. Further, the ink passing through each of the perforated dots is reliably separated from the ink passing through adjacent perforation dots before it is deposited onto the printing paper so that excessive deposition of the ink is avoided and the time required for drying the printing ink is reduced so that offsetting may be avoided.

REFERENCES:
patent: 4568951 (1986-02-01), Hasegawa et al.
patent: 4896597 (1990-01-01), Hayata et al.
patent: 5243906 (1993-09-01), Okusawa
patent: 5245932 (1993-09-01), Ujiie

Affiliated with

Also associated with

Rating

Thermal stencil master plate and method for processing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal stencil master plate and method for processing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal stencil master plate and method for processing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-376847