Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Reexamination Certificate
2005-11-15
2005-11-15
Ngo, Hung V. (Department: 2831)
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
C361S718000, C174S034000
Reexamination Certificate
active
06965071
ABSTRACT:
Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.
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Chomerics EMI Shielding Laminates. Applicants request the Examiner to consider this reference as prior art under 102(a), however, Applications respectfully reserve the right to supplement this Information Disclosure Statement and take a contrary position should it be necessary.
Chomerics CHO-Shield Conductive Coatings. Applicants request the Examiner to consider this reference as prior art under 102(a), however, Applicants respectfully reserve the right to supplement this Information Disclosure Statement and take a contrary position should it be necessary.
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de Sorgo Miksa
Gagnon Matthew T.
Lionetta William G.
Liu Peter W.
Oppenheim Scott M.
Molnar, Jr. John A.
Ngo Hung V.
Parker-Hannifin Corporation
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