Thermal spray coating having improved addherence, low residual s

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427423, B05D 108

Patent

active

047880775

ABSTRACT:
Method of thermal spray coating a substrate by projecting heat-softened particles onto said substrate including the steps of contacting particles to be projected and coated onto the substrate with a body of hot gases, heating the particles in the hot gases to a temperature near, at or above their melting point and impinging the heated particles against the substrate to provide a coating having the desired thickness wherein said particles are first heated to a relatively higher temperature and impinged onto the substrate to provide a first layer having a thickness that is a fraction of the desired thickness and thereafter heating coated particles to a lower temperature in the hot gases and impinging them on the first layer to provide a second layer having a thickness which together with the thickness of the first layer equals the desired thickness. The invention also includes the resulting coated substrates.

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