Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-01-03
2006-01-03
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C361S719000, C257S712000, C257S715000, C165S185000
Reexamination Certificate
active
06982874
ABSTRACT:
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
REFERENCES:
patent: 3404061 (1968-10-01), Shane et al.
patent: 4878152 (1989-10-01), Sauzade et al.
patent: 4895713 (1990-01-01), Greinke et al.
patent: 5224030 (1993-06-01), Banks et al.
patent: 5390734 (1995-02-01), Voorhes et al.
patent: 5825624 (1998-10-01), Arnold et al.
patent: 5902762 (1999-05-01), Mercuri et al.
patent: 5991155 (1999-11-01), Kobayashi et al.
patent: 6090484 (2000-07-01), Bergerson
patent: 6105662 (2000-08-01), Suzuki
patent: 6131651 (2000-10-01), Richey, III
patent: 6245400 (2001-06-01), Tzeng et al.
patent: 6257328 (2001-07-01), Fujiwara et al.
patent: 6482520 (2002-11-01), Tzeng
patent: 6503626 (2003-01-01), Norley et al.
patent: 6538892 (2003-03-01), Smalc
patent: 6771495 (2004-08-01), Fujiwara et al.
patent: WO 02/096615 (2002-12-01), None
patent: WO 03/051772 (2003-06-01), None
patent: WO 03/057475 (2003-07-01), None
Japan Unexamined Patent Publication—JP2004023065A.
Japan Unexamined Patent Publication—JP2004023066A.
DXX03-013 Tokugan 2003-382882, Application date Nov. 12, 2003.
DXX03-022 Tokugan 2003-375005, Application date Nov. 4, 2003.
DXX03-031 Tokugan 2004-017710, Application date Jan. 26, 2004.
Japan Patent Publication Hei 10-56114, JP1998056114A.
Japan Patent Publication Hei 11-179830, JP1999179830A.
Reynolds, III Robert Anderson
Shives Gary D.
Smalc Martin David
Advanced Energy Technology Inc.
Cartiglia James R.
Chervinsky Boris
Waddey & Patterson , P.C.
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