Thermal solution for a mezzanine card

Details Thermal solution for a mezzanine card Thermal solution for a mezzanine card

2005-07-12

2005-07-12

Datskovsky, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S737000, C165S080300, C165S165000, C257S707000

Reexamination Certificate

active

06917523

ABSTRACT:
A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

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Draft Standard Physical and Environmental Layers for PCI Mezzanine Cards: PMC; Sponsored by the Microprocessor&Microcomputer Standards Committee(MMSC)of the IEEE Computer SocietyP1386.1/Draft 2.4; Jan. 12, 2001, pp. 1-10.
Draft Standard for a Common Mezzanine Card Familty: CMC; Sponsored by the Microprocessor & Microcomputer Standards Committee (MMSC) of the IEEE Computer Society P1386/Draft 2.4a; Mar. 12, 2001, pp. 1-49.

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