Thermal shutdown circuit and method for sensing thermal gradient

Electricity: electrical systems and devices – Safety and protection of systems and devices – Circuit interruption by thermal sensing

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323907, H02H 504

Patent

active

059461810

ABSTRACT:
A circuit provides at least partial thermal shutdown of an integrated circuit chip including a functional circuit (7) in response to detection of a hot spot in a first area of the chip. First (Q1) and second (Q3) transistors in a second area (3) of the chip are located a first distance (10) from the second area of the chip, and third (Q4) and fourth (Q2) transistors in a third area (4) of the chip are located a second distance (11) substantially greater than the first distance from the first area. The functional circuit (7) dissipates power in the first area, causing a temperature in the hot spot to rise to approximately a first temperature T3 and causing the temperature of the first and second transistors to be a second temperature T2 and causing the temperature of the third and fourth transistors to be a third temperature T1. The first, second, third and fourth transistors are operated to in effect extrapolate between the second T2 and third T1 temperatures to produce a current (IOUT) proportional to the difference between the second T2 and third T1 temperature, and hence representative of the first temperature T3. At least a portion of the functional circuit turned off to reduce the temperature of the first region has a value that exceeds a predetermined maximum value.

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