Thermal shock resistant package having an ultraviolet light tran

Details Thermal shock resistant package having an ultraviolet light tran Thermal shock resistant package having an ultraviolet light tran

1978-04-24

1982-04-20

James, J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 30, 357 80, 29588, 174 52S, H01L 2302, H01L 2312, H01L 3902

Patent

active

043262147

ABSTRACT:
A hermetically sealed thermal shock resistant ultraviolet light responsive read only semiconductor chip package includes a pair of mating ceramic members one of which mounts an ultraviolet sensitive semiconductor chip and the other which provides a window having an ultraviolet light transmitting glass sealingly mounted therein. The ultraviolet responsive chip is hermetically packaged by selecting a ceramic base member and a mating ceramic cap member, mounting an ultraviolet sensitive chip on the base and forming an ultraviolet transmitting window in the cap member and thereafter mating and sealing the members together so that the window covers the chip for permitting the transmission of ultraviolet rays thereto.

REFERENCES:
patent: 2647070 (1953-07-01), Litton
patent: 3217379 (1965-11-01), Mesecke
patent: 3220095 (1965-11-01), Smith
patent: 3469148 (1969-09-01), Lund
patent: 3495023 (1970-02-01), Hessinger et al.
patent: 3622419 (1971-11-01), London
patent: 3665592 (1972-05-01), Apospors
patent: 3697666 (1972-10-01), Wakley et al.
patent: 3706010 (1972-12-01), Laermer
patent: 3848077 (1974-11-01), Whitman
patent: 4008945 (1977-02-01), Scherer
patent: 4079511 (1978-03-01), Grabbe
patent: 4105861 (1978-08-01), Hascoe
Mos Eprom Intel's Black Ceramic Package by Ken Kwong, Oct. 1976.

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