Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen
Patent
1999-08-03
2000-02-15
Gutierrez, Diego
Thermal measuring and testing
Temperature measurement
In spaced noncontact relationship to specimen
374153, 374132, G01J 500
Patent
active
060244879
ABSTRACT:
An infrared thermal sensor assembly for sensing the temperature of a target, the sensor assembly including a heat sink having a bore therethrough; a thermopile housed in the bore; and a heater operative to heat the heat sink.
REFERENCES:
patent: 2493078 (1950-01-01), Mead
patent: 3472497 (1969-10-01), Preszler
patent: 3601611 (1971-08-01), Kendall
patent: 3690176 (1972-09-01), Connolly et al.
patent: 4301682 (1981-11-01), Everest
patent: 4634294 (1987-01-01), Christol et al.
patent: 4867574 (1989-09-01), Jenkofsky
patent: 4900162 (1990-02-01), Beckman et al.
patent: 4904090 (1990-02-01), Oliver
patent: 4977431 (1990-12-01), Fuji
patent: 4986672 (1991-01-01), Beynon
patent: 5056929 (1991-10-01), Watanabe et al.
patent: 5171733 (1992-12-01), Hu
patent: 5274423 (1993-12-01), Kusumoto
patent: 5276482 (1994-01-01), Nakanishi
patent: 5287155 (1994-02-01), Arai et al.
patent: 5293877 (1994-03-01), O'Hara et al.
patent: 5315350 (1994-05-01), Hirobe et al.
patent: 5366291 (1994-11-01), Nakagama et al.
patent: 5788382 (1998-08-01), Egbert et al.
Casper Robert
Gillen John
Fernandez Maria
Gutierrez Diego
Output Technology Corporation
LandOfFree
Thermal sensor assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal sensor assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal sensor assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1900557