Thermal sensor and thermal sensor housing mechanism

Details Thermal sensor and thermal sensor housing mechanism Thermal sensor and thermal sensor housing mechanism

2007-07-03

2007-07-03

Verbitsky, Gail (Department: 2859)

Thermal measuring and testing

Temperature measurement

Combined with diverse art device

C374S208000

Reexamination Certificate

active

11019283

ABSTRACT:
A thermal sensor is pushed into a housing bushing so that a pin of the sensor is locked in an opening of the housing bushing. The thermal sensor is thereby easily fixed within the housing bushing. Further, the thermal sensor does not rotate within the housing bushing.

REFERENCES:
patent: 3845661 (1974-11-01), Hollweck et al.
patent: 5733044 (1998-03-01), Rose et al.
patent: A-2001-241584 (2001-09-01), None
First Office Action from Chinese Patent Office issued on Aug. 14, 2006 for the corresponding Chinese patent application No. 2005100059932 (a copy and English translation thereof).
Notice of Final Rejection from Korean Patent Office issued on Sep. 18, 2006 for the corresponding Korean patent application No. 10-2004-0110404 (a copy and English translation thereof).

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