Thermal sensing and reset protection for an integrated...

Details Thermal sensing and reset protection for an integrated... Thermal sensing and reset protection for an integrated...

2009-05-08

2011-10-04

Pham, Hoai V (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Magnetic field

C257S428000, C257SE31131

Reexamination Certificate

active

08030719

ABSTRACT:
There is provided a semiconductor package that includes a first semiconductor die mounted on a package substrate. The semiconductor package further includes a second semiconductor die mounted on the first semiconductor die and including a thermal sensing and reset protection circuit. The thermal sensing and reset protection circuit is configured to determine a temperature of the first semiconductor die and to provide a reset protection signal to the first semiconductor die when the temperature of the first semiconductor die is substantially equal to a preset temperature so as to protect the first semiconductor die from thermal runaway. The reset protection signal can cause the first semiconductor die to be in a sleep mode or a reset state.

REFERENCES:
patent: 6330668 (2001-12-01), Curiger
patent: 6786639 (2004-09-01), Glenford
patent: 7465610 (2008-12-01), Nadd et al.

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