Thermal release wafer mount tape with B-stage adhesive

Details Thermal release wafer mount tape with B-stage adhesive Thermal release wafer mount tape with B-stage adhesive

2008-04-08

2008-04-08

Malsawma, Lex (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C428S354000

Reexamination Certificate

active

11491316

ABSTRACT:
In one aspect, an improved wafer mount tape is provided. The wafer mount tape includes a base layer, a release layer that expands when activated and a B-stageable adhesive layer that is positioned over the release layer. In a method aspect of the invention, a wafer level method of placing an adhesive layer on the back surface of integrated circuit devices is described. In this aspect, a wafer is secured to the mount tape. The wafer is diced while the wafer is attached to the mounting tape. After the wafer has been diced and any other desired wafer level processing is completed, the dice may be released individually or in groups by heating (or otherwise activating) localized areas of the tape under selected die to a temperature sufficient to release the selected die. The expansion of the release layer during the release operation serves to lift the selected die relative to adjacent die thereby facilitating picking. The B-stageable adhesive layer remains secured to the back surface of the die and therefore may be used to attach the respective dice to associated support structures.

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