Thermal recording head

Details Thermal recording head Thermal recording head

1993-07-06

1995-08-22

Tran, Huan H.

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

347202, 347204, 347205, B41J 2335, B41J 2345

Patent

active

054444756

ABSTRACT:
A thin-film thermal recording head, used in a facsimile machine or a thermal printer, including heat resistors formed from only a Cr--Si--SiO or Ta--Si--SiO alloy thin-film resistor layer and a chromium, molybdenum, nickel, or tungsten thin-film conductor layer. The heat resistor is formed on a substrate having a linear thermal expansion coefficient from room temperature to 300.degree. C. of 5.times.10.sup.-8 /.degree.C. or less. The heat resistor is also described having a thin anti- abrasion layer with thickness of 0.5 .mu.m or less. The thin-film thermal recording head is also described in monolithic form with a portion of the heat resistor formed to directly contact an output electrode of a drive LSI circuit. In this case, a double-layer thermal-insulation layer can be formed between the substrate and the portion of the heat resistor that contacts and heats heat-sensitive recording paper. The two layers of the thermal-insulation layer are formed from a heat-resistant resin and an inorganic insulator.

REFERENCES:
patent: 4680593 (1987-07-01), Takeno et al.
patent: 4868584 (1989-09-01), Nikaido et al.

Affiliated with

Also associated with

Rating

Thermal recording head does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal recording head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal recording head will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2145266