Thermal radiant source with filament encapsulated in protective

Electric resistance heating devices – Heating devices – Radiant heater

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219553, 219544, 338308, 338262, 313578, 313522, 356352, H01K 700

Patent

active

056446764

ABSTRACT:
An electrically modulatable radiant source includes an essentially planar substrate, a well or hole formed in the substrate, and at least one incandescent filament attached to the substrate. The incandescent filament is aligned with the well or hole and is formed of a metallic compound which readily oxidizes at an operating temperature of the incandescent filament. An oxidation resistant film encapsulates the incandescent filament to prevent the filament from oxidizing. Furthermore, contact pads are formed on the substrate at both ends of the incandescent filament for feeding electric current to the incandescent filament.

REFERENCES:
patent: 4315968 (1982-02-01), Suplinskas et al.
patent: 4352006 (1982-09-01), Zega
patent: 4501144 (1985-02-01), Higashi et al.
patent: 4682503 (1987-06-01), Higashi et al.
patent: 4706061 (1987-11-01), Johnson
patent: 4724356 (1988-02-01), Daehler
patent: 4902138 (1990-02-01), Goeldner et al.
patent: 5021711 (1991-06-01), Madden et al.
patent: 5068517 (1991-11-01), Tsuyuki et al.
patent: 5285131 (1994-02-01), Muller et al.
patent: 5408319 (1995-04-01), Halbout et al.
patent: 5464966 (1995-11-01), Gaitan et al.
patent: 5500569 (1996-03-01), Blomberg et al.
Laser Focus World, vol. 28, No. 12, Dec. 1, 1992, pp. 26, 28, 31, "Hot-filament microlamps now feasible," Eugene D. Jungbluth.
Bross, et al, "Modular Resistor Array", IBM Tech. Disclosure, vol. 13, No. 5, Oct. 1970.

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