Coating apparatus – Gas or vapor deposition
Reexamination Certificate
2006-08-08
2009-12-15
Lund, Jeffrie R (Department: 1792)
Coating apparatus
Gas or vapor deposition
C118S724000, C118S728000, C156S345330, C156S345340
Reexamination Certificate
active
07632354
ABSTRACT:
A thermal processing system with improved gas flow and method for injecting a process gas into a thermal processing system. The thermal processing system has an injection section with injection outlets that inject process gas into a processing space and a delivery section that delivers process gas to the injection section. The delivery section may be coupled with the injection section at an inlet disposed between opposite ends of the injection section. A fluid lumen of the injection section may have a larger cross-sectional area than a fluid lumen of the delivery section. The thermal processing system may include an inner tube, which surrounds the processing space, having a slit through which the processing space communicates with an annular pumping space defined between the inner tube and an outer tube of the thermal processing system.
REFERENCES:
patent: 5458685 (1995-10-01), Hasebe et al.
patent: 5902103 (1999-05-01), Maeda et al.
patent: 6146461 (2000-11-01), Yang et al.
patent: 2003/0024477 (2003-02-01), Okuda et al.
patent: 2003/0164143 (2003-09-01), Toyoda et al.
patent: 2004/0025786 (2004-02-01), Kontani et al.
patent: 2006/0216418 (2006-09-01), Matsuura
patent: 2006/0216950 (2006-09-01), Matsuura
patent: 2007/0007646 (2007-01-01), Yamaguchi et al.
patent: 2007/0062646 (2007-03-01), Ogawa et al.
patent: 2003024718 (1991-01-01), None
patent: 2002-280378 (2002-01-01), None
patent: 2002-280378 (2002-09-01), None
patent: 2006-080098 (2002-09-01), None
patent: 2002222806 (2002-09-01), None
patent: 2005-209668 (2005-08-01), None
patent: 2005209668 (2005-08-01), None
patent: 2006080098 (2006-03-01), None
patent: 2006080101 (2006-03-01), None
patent: WO2004027846 (2004-01-01), None
European Patent Office, International Search Report issued in corresponding PCT Application serial No. PCT/US2007/068474 dated Dec. 6, 2007.
Asari Shinji
Dip Anthony
Gandhi Meenakshisundaram
Chandra Satish
Lund Jeffrie R
Tokyo Electron Limited
Wood Herron & Evans LLP
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