Thermal processing of photoresist materials

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

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430325, 430326, 430330, 430394, G03C 500

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active

048142433

ABSTRACT:
In an image reversal process (12), a photoresist coating on a wafer is baked in an oven (19) in the presence of amine gas to fix the exposed photoresist portion (14). A computer (21) is programmed with a characterization of the photoresist film. The output of a temperature sensing element (23) mounted on the wafer is directed to the computer which, in response, controls introduction of the amine gas and withdrawal of the wafer after a predetermined extent of reaction in the coating.

REFERENCES:
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patent: 4567132 (1986-01-01), Fredericks et al.
patent: 4568631 (1986-02-01), Badami et al.
patent: 4569717 (1986-02-01), Ohgami et al.
patent: 4624910 (1986-11-01), Takeda
patent: 4647172 (1987-03-01), Batchelder et al.
patent: 4717645 (1988-01-01), Kato et al.

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