Thermal processing equipment calibration method

Data processing: measuring – calibrating – or testing – Calibration or correction system – Temperature

Reexamination Certificate

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Details

C702S085000

Reexamination Certificate

active

11214616

ABSTRACT:
The invention relates to a method for calibrating thermal processing equipment used for heat treatment of a multilayer substrate, in particular a multilayer semiconductor substrate. A calibration test profile is determined by processing a calibration test substrate according to thermal process parameters that produce multilayer substrates having an even thickness profile, and/or having reduced slip lines and/or reduced wafer deformation, and/or having other desired and predetermined properties. Then a particular thermal processing equipment is calibrated by determining thermal process parameters for that equipment so that a test substrate processed with these parameters will have the determined calibration test profile.

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