Thermal processing apparatus and thermal processing method

Details Thermal processing apparatus and thermal processing method Thermal processing apparatus and thermal processing method

2008-05-13

2008-05-13

Fuqua, Shawntina (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S405000, C219S411000, C392S414000, C392S418000, C118S724000, C118S725000, C118S050100

Reexamination Certificate

active

11064755

ABSTRACT:
In a thermal processing apparatus, using a lamp for heating a substrate, an opening is formed for a camera unit, which is used to image portions of an auxiliary ring supporting the substrate, to obtain the position of the center of the auxiliary ring. The camera further images the substrate to determine the center of the substrate before the thermal processing apparatus receives and places the substrate on the auxiliary ring. The thermal processing apparatus moves the substrate so that the center thereof coincides with the center of the auxiliary ring, and thereafter places the former on the latter. Thus, the auxiliary ring can be designed to reduce overlaps of the auxiliary ring and the outer edge of the substrate while overlaps can be uniform over the entire circumference of the substrate to improve temperature uniformity of the substrate.

REFERENCES:
patent: 6163648 (2000-12-01), Moto et al.
patent: 6831258 (2004-12-01), Hayasaki et al.
patent: 6885815 (2005-04-01), Kusuda et al.
patent: 7038173 (2006-05-01), Takahashi et al.
patent: 2000-058471 (2000-02-01), None
patent: 2000-150405 (2000-05-01), None
English translation of Abstract from Japanese Patent Application Laid-Open No. 2000-150405.
English translation of Abstract from Japanese Patent Application Laid-Open No. 2000-058471.

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