Thermal processing apparatus

Details Thermal processing apparatus Thermal processing apparatus

2005-03-15

2005-03-15

Thompson, Craig A. (Department: 2813)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

Reexamination Certificate

active

06868302

ABSTRACT:
In a thermal processing apparatus irradiating a substrate with light from a lamp for heating the substrate, an opening is formed in a reflector for mounting a camera unit. The camera unit images three portions of an auxiliary ring supporting the substrate, for obtaining the position of the center of the auxiliary ring before the thermal processing apparatus receives the substrate therein. The camera unit further images the substrate for obtaining the position of the center of the substrate before the thermal processing apparatus receives the substrate therein and places the same on the auxiliary ring. The thermal processing apparatus moves the substrate so that the center thereof coincides with the center of the auxiliary ring, and thereafter places the former on the latter. Thus, the auxiliary ring can be so designed as to reduce overlaps of the auxiliary ring and the outer edge of the substrate while the overlaps can be rendered uniform over the entire circumference of the substrate for improving temperature uniformity of the substrate.

REFERENCES:
patent: 6151447 (2000-11-01), Moore et al.
patent: 6163648 (2000-12-01), Moto et al.
patent: 2000-058471 (2000-02-01), None
patent: 2000-150405 (2000-05-01), None
English translation of Abstract from Japanese Patent Application Laid-Open No. 2000-150405.
English translation of Abstract from Japanese Patent Application Laid-Open No. 2000-058471.

Affiliated with

Also associated with

Rating

Thermal processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3428633