Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1997-03-28
1999-12-21
Pelham, Joseph
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
219411, 219536, 118725, 118 501, H05B 306, H05B 366, F27D 1502, C23C 1600
Patent
active
060052252
ABSTRACT:
A vertical rapid heating furnace for treating semiconductor wafers comprising a hot wall reaction tube positioned within a cylindrical array of circular parallel heating elements substantially concentric therewith, each heating element being spaced from the hot wall reaction tube, each heating element comprising a coil of resistance heating conductor. The coiled resistance heating conductor can be a coil of resistance heating wire, the coil having an outer diameter of from 1 to 7 mm and supported in an annular heating element support. Each heating element support is dimensioned to support and accommodate the thermally expanded heating element supported therein at both the minimum and maximum furnace temperatures. Preferably, each annular heating element support is provided by an annular recess in the insulation surrounding the array of heating elements. The preferred vertical rapid heating and cooling furnace for treating semiconductor wafers comprises a hot wall reaction tube and a cylindrical array of circular parallel heating elements substantially concentric therewith and spaced therefrom to define a cooling gas passageway between said hot wall reaction tube and said cylindrical array of heating elements. The cooling gas passageway has lower and upper ends, the furnace has a cooling gas inlet opening in communication with said lower end, and a cooling gas exhaust outlet in communication with said upper end.
REFERENCES:
patent: 2856500 (1958-10-01), Hartman
patent: 3226254 (1965-12-01), Reuschel
patent: 4062318 (1977-12-01), Ban et al.
patent: 4263872 (1981-04-01), Ban
patent: 4268742 (1981-05-01), Cottrell et al.
patent: 4339645 (1982-07-01), Miller
patent: 4363959 (1982-12-01), Cottrell et al.
patent: 4493089 (1985-01-01), Abell
patent: 4559412 (1985-12-01), Howard et al.
patent: 4695706 (1987-09-01), Mizushina
patent: 4770590 (1988-09-01), Hugues et al.
patent: 4849608 (1989-07-01), Muraoka et al.
patent: 4926793 (1990-05-01), Arima et al.
patent: 5038019 (1991-08-01), McEntire et al.
patent: 5076206 (1991-12-01), Bailey et al.
patent: 5095192 (1992-03-01), McEntire et al.
patent: 5097890 (1992-03-01), Nakao
patent: 5124534 (1992-06-01), Williams et al.
patent: 5127365 (1992-07-01), Koyama et al.
patent: 5187771 (1993-02-01), Uchida
patent: 5229576 (1993-07-01), Nakao et al.
patent: 5249960 (1993-10-01), Monoe
patent: 5320680 (1994-06-01), Learn et al.
patent: 5324920 (1994-06-01), Nakao
patent: 5346555 (1994-09-01), Nunotani et al.
patent: 5360336 (1994-11-01), Monoe
patent: 5443649 (1995-08-01), Sibley
patent: 5482558 (1996-01-01), Watanabe et al.
patent: 5506389 (1996-04-01), Hidano et al.
patent: 5507639 (1996-04-01), Monoe
patent: 5525057 (1996-06-01), Monoe
patent: 5536919 (1996-07-01), Taheri
patent: 5578232 (1996-11-01), Engelke
patent: 5616264 (1997-04-01), Nishi et al.
patent: 5618351 (1997-04-01), Koble, Jr. et al.
patent: 5622639 (1997-04-01), Kitayama et al.
patent: 5626680 (1997-05-01), Porter et al.
patent: 5676869 (1997-10-01), Nakayama et al.
patent: 5679168 (1997-10-01), Porter et al.
patent: 5763856 (1998-06-01), Ohkase
Koble, Jr. Terry A.
Kowalski Jeffrey M.
Pack Jon H.
Ratliff Christopher T.
Yang Michael H.
Pelham Joseph
Silicon Valley Group Inc.
LandOfFree
Thermal processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-507364