Thermal process module for substrate coat/develop system

Details Thermal process module for substrate coat/develop system Thermal process module for substrate coat/develop system

1994-10-11

1996-09-10

Werner, Frank E.

Material or article handling

Load carried along a horizontal linear path

Having gripper means

901 40, 414936, 414749, B65G 2500

Patent

active

055539947

ABSTRACT:
In a photolithography system, baking and cooling of semiconductor substrates is done in a thermal process module that uses a unique mechanism including pulleys to route vacuum tubing to a transfer arm. Specifically, the mechanism includes a pair of pulleys and a vacuum tube wrapped around the pulleys. The vacuum tube has a movable portion connected to the transfer arm which is reciprocable between the pair of pulleys. The vacuum tube also has a stationary portion that is connected to the movable portion to form an endless loop. The stationary portion of the vacuum tube is rigidly connected to a vacuum supply line in the housing of the thermal process module.

REFERENCES:
patent: 4280786 (1981-07-01), Dyche
patent: 4604026 (1986-08-01), Barrett
patent: 4683654 (1987-08-01), Scholten et al.
patent: 4971515 (1990-11-01), Pol et al.
patent: 4975016 (1990-12-01), Pellenc et al.
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5180276 (1993-01-01), Hendrickson
patent: 5193972 (1993-03-01), Engelbrecht

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