Thermal probe assembly with mold-over crimp sensor packaging

Details Thermal probe assembly with mold-over crimp sensor packaging Thermal probe assembly with mold-over crimp sensor packaging

1997-08-18

1998-05-12

Gutierrez, Diego F. F.

Thermal measuring and testing

Temperature measurement

By electrical or magnetic heat sensor

439877, 338 28, G01K 722, H01R 420

Patent

active

057496560

ABSTRACT:
The present invention generally includes a thermal sensor assembly for a vehicle application including an insert molded part having a thermistor/wire sub-assembly and terminal that are assembled with a "F" crimp and resistance welded that are insert molded to a pre-mold or connector that has a shut-off plate seal on the terminal's insulation crimp. The invention provides a more robust package that is resistant to vibration, insulates the terminals from shorting and permits further handling of the sub-assembly without damage to the terminals. Further, the thermistor can be very small and a very small wire can be used to connect the terminal to the thermistor element. Because a smaller thermistor can be utilized, a much smaller probe tip can be design into the thermal sensor assembly. The insert molded part can either be a preform for press-fit applications or a male sensor connector for applications requiring a metal housing. The pre-molded plastic protects the terminals from short circuiting to the sensor shell or other terminal.

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