Incremental printing of symbolic information – Thermal marking apparatus or processes – Specific resistance recording element type
Reexamination Certificate
2011-03-22
2011-03-22
Tran, Huan H (Department: 2861)
Incremental printing of symbolic information
Thermal marking apparatus or processes
Specific resistance recording element type
Reexamination Certificate
active
07911489
ABSTRACT:
A thermal print head A includes a substrate1, a heat generating resistor3supported by the substrate1, and a protective layer4which covers the heat generating resistor3. The protective layer4includes a first inner layer41which is in contact with the heat generating resistor3, a second inner layer42formed on the first inner layer41, and an outer layer43. Part of the second inner layer42is formed as a rough surface42awhich has a surface roughness of Ra 0.1 through 0.3. The rough surface42ais disposed at a position corresponding to the heat generating resistor3. The outer layer43is made of a metal nitride or a chemical compound containing a metal nitride, and has a thickness of 0.1 through 0.5 μm.
REFERENCES:
patent: 6175377 (2001-01-01), Noshita et al.
patent: 6330013 (2001-12-01), Kashiwaya et al.
patent: 6441840 (2002-08-01), Sato et al.
patent: 6445402 (2002-09-01), Kinjyo et al.
patent: 6469724 (2002-10-01), Hayashi et al.
patent: 6483528 (2002-11-01), Yamade et al.
patent: 7443409 (2008-10-01), Sako
patent: 63-81062 (1988-04-01), None
patent: 2000-141729 (2000-05-01), None
patent: 2000-255089 (2000-09-01), None
patent: 2000-272155 (2000-10-01), None
patent: 2002-2005 (2002-01-01), None
patent: 2005-313513 (2005-11-01), None
Kanei Naofumi
Yamade Takumi
Hamre Schumann Mueller & Larson P.C.
Rohm & Co., Ltd.
Tran Huan H
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