Thermal print head

Details Thermal print head Thermal print head

1973-06-07

1976-01-06

Harris, G.

Electric heating

Heating devices

Combined with diverse-type art device

219543, 357 15, H05B 312

Patent

active

039314928

ABSTRACT:
The thermal print head comprises a substrate, a semiconductor wafer fabricated thereover, a plurality of junctions formed on the semiconductor wafer, and electrodes to supply an inverse current to the junctions. The junctions are arranged so as to correspond to the pattern of the symbol, such as letters, to be printed. Each of the junctions is used as a heating element. Heat is evolved at the junction when the inverse current flows through the potential barrier which is formed at the junction. The heat evolved is used for the heating element.

REFERENCES:
patent: 3515850 (1970-06-01), Cady, Jr.
patent: 3642528 (1972-02-01), Kimera
patent: 3719797 (1973-03-01), Andrews et al.
patent: 3774170 (1973-11-01), Koch
patent: 3781825 (1973-12-01), Burker et al.
S. M. Krakauer et al., Hot Carrier Diodes Switch in Picoseconds, 7-19-63, pages 53-55.

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