Thermal pole-tip recession/slide shape variation reduction

Details Thermal pole-tip recession/slide shape variation reduction Thermal pole-tip recession/slide shape variation reduction

2006-02-21

2006-02-21

Davis, David (Department: 2652)

Dynamic magnetic information storage or retrieval

Fluid bearing head support

Disk record

Reexamination Certificate

active

07002779

ABSTRACT:
A bond pad is elevated from a slider body by a conductive post. The bond pad is disposed atop the post, which typically possesses a cross-sectional area smaller than the surface are of the bond pad. Thus, rather than having the entire surface of the bond pad in contact with the slider body, only the cross-sectional area of the conductive post is in contact therewith. Alternatively, a bond pad may be split into two electrically coupled pads: one pad used for housing a permanent bond, and a second pad used for housing a temporary bond. The pad used to house the temporary wire bond may be disposed atop a sacrificial layer. After a lapping process, the sacrificial layer may be etched away, thereby permitting the temporary pad to be removed.

REFERENCES:
patent: 4022641 (1977-05-01), Lindberg
patent: 4154877 (1979-05-01), Vratny
patent: 5084299 (1992-01-01), Hirsch et al.
patent: 5570249 (1996-10-01), Aoyagi et al.
patent: 5710683 (1998-01-01), Sundaram
patent: 5731243 (1998-03-01), Peng et al.
patent: 5771138 (1998-06-01), Zarouri et al.
patent: 5796549 (1998-08-01), Sedbrook et al.
patent: 5808834 (1998-09-01), Jurgenson
patent: 5859748 (1999-01-01), Itoh
patent: 5894380 (1999-04-01), Sasada et al.
patent: 6165886 (2000-12-01), Lin et al.
patent: 6177636 (2001-01-01), Fjelstad

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