Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-08-29
2003-09-30
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C062S003200, C062S259200, C165S080200, C165S080300, C165S185000, C257S722000, C361S690000, C361S705000, C361S708000, C361S710000
Reexamination Certificate
active
06628522
ABSTRACT:
TECHNICAL FIELD
This disclosure relates generally to microelectromechanical systems (MEMS), and in particular but not exclusively, relates to MEMS devices to improve fluid flow, such for the enhancement of thermal performance of heat sinks.
BACKGROUND
Many devices generate heat when they operate. For instance, as computer processors increase in speed of operation, the amount of heat generated by the processors increases. To prevent such devices from overheating and for reliability purposes, the generated heat must be dissipated or otherwise taken away from the devices.
A common technique to dissipate heat is to attach heat sinks to the devices. Heat sinks are typically made from copper or other suitable heat-conductive material, and often include “fins” to increase its surface area for heat dissipation. In operation, a heat sink conducts heat away from a device and dissipates the heat through its fins, sometimes with the aid of a fan that blows across the fins.
In performing this heat transfer, two types of thermal resistances are encountered. Conduction resistance is encountered when heat is transferred between solid materials. In this case, use of a good heat conductive material, such as copper for the heat sink, allows for more efficient heat transfer away from the device.
Convection resistance is encountered when transferring heat from a solid material, such as from surfaces of the fins of the heat sink, to the surrounding fluid (e.g., the surrounding fluid is air in this instance). A thick boundary layer forms along each fin, thereby reducing the effectiveness of air cooling. That is, the thickness of the boundary layer decreases the heat transfer surface's (e.g., the fins') efficiency to reject heat to the surrounding fluid. Moreover, the use of an additional fan to aid in heat dissipation from the heat sink further increases inefficiency of the overall system.
REFERENCES:
patent: 5473506 (1995-12-01), Kikinis
patent: 6016250 (2000-01-01), Hanners
patent: 59-87844 (1984-05-01), None
patent: 40-3070162 (1989-08-01), None
patent: 1-276753 (1989-11-01), None
Koeneman Paul B.
Trautman Mark A.
Blakely , Sokoloff, Taylor & Zafman LLP
Thompson Gregory
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