Thermal measuring and testing – Temperature measurement – Combined with diverse art device
Patent
1998-09-17
2000-07-25
Bennett, G. Bradley
Thermal measuring and testing
Temperature measurement
Combined with diverse art device
133 43, G01K 100
Patent
active
06092926&
ABSTRACT:
A method for monitoring the operating temperature of a semiconductor device. The method comprising the steps of: placing a thermal coupling material between the bottom of the semiconductor device and the top of a printed circuit board for inserting the device thereinto; inserting a sensor so to be at least partially covered by the thermal coupling material; and measuring the temperature from the sensor within a predetermined time interval. In accordance with another aspect of the invention, an apparatus is described to carry out the above process.
REFERENCES:
patent: 4475145 (1984-10-01), Heil et al.
patent: 5206713 (1993-04-01), McGeary
patent: 5483102 (1996-01-01), Neal et al.
patent: 5603570 (1997-02-01), Shimizu
patent: 5679266 (1997-10-01), Darekar et al.
patent: 5847929 (1998-12-01), Bernier et al.
patent: 5931580 (1999-08-01), Wyland
Garcia Ray
Honeycutt Kendall Anthony
Still Stephen Eugene
Tout, Jr. James J.
Bennett G. Bradley
Gibbons Jon A.
International Business Machines - Corporation
Verbitsky Gail
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