Thermal monitoring system for semiconductor devices

Thermal measuring and testing – Temperature measurement – Combined with diverse art device

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133 43, G01K 100

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06092926&

ABSTRACT:
A method for monitoring the operating temperature of a semiconductor device. The method comprising the steps of: placing a thermal coupling material between the bottom of the semiconductor device and the top of a printed circuit board for inserting the device thereinto; inserting a sensor so to be at least partially covered by the thermal coupling material; and measuring the temperature from the sensor within a predetermined time interval. In accordance with another aspect of the invention, an apparatus is described to carry out the above process.

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patent: 5483102 (1996-01-01), Neal et al.
patent: 5603570 (1997-02-01), Shimizu
patent: 5679266 (1997-10-01), Darekar et al.
patent: 5847929 (1998-12-01), Bernier et al.
patent: 5931580 (1999-08-01), Wyland

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