Thermal model for central processing unit

Data processing: measuring – calibrating – or testing – Measurement system – Temperature measuring system

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

374134, 374137, 713300, G01K 1700

Patent

active

060061685

ABSTRACT:
A technique for implementing a programmable thermal model of an integrated circuit component such as a central processing unit (CPU) and its associated heat sink. The model estimates the die temperature of the component as if there were no cooling devices present in the system such as a forced air cooling fan by integrating the thermal energy added when the component is active and by integrating the thermal energy removed when it is idle. A programmable power value may be used to represent the heat added to the model at each model sample period. The effect of a heat sink in cooling the idle component may be modeled by reducing the value of the heat accumulator by a predetermined fractional amount during each sample period. The decay time constant for the model may be changed by then adjusting the sample period. With an accurate model estimate predicting the component temperature in the absence of cooling being instantaneously available, any associated cooling device such as a fan can be operated in such a manner as to turn on only when it is estimated to actually be needed and to be kept off at all other times. In addition, a turn off delay can be implemented in order to avoid undesirable cycling effects.

REFERENCES:
Thomas et al., "Temperature Estimation of Semiconductor Die Heating Using Numerical Techniques in Real Time", IEE, Jan. 29, 1997.
Fitch et al., "Thermap: A Thermal Model for Microprocessors", IEEE, Sep. 1995.
Rosten et al., "Thermal Modeling of the Pentium Processor Package", IEEE, 1994.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal model for central processing unit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal model for central processing unit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal model for central processing unit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-515490

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.