Thermal micro-valves for micro-integrated devices

Details Thermal micro-valves for micro-integrated devices Thermal micro-valves for micro-integrated devices

2007-03-27

2007-03-27

Keasel, Eric (Department: 3753)

Fluid handling

Flow affected by fluid contact, energy field or coanda effect

Means to regulate or vary operation of device

C137S251100

Reexamination Certificate

active

10696889

ABSTRACT:
The movement and mixing of microdroplets through microchannels is described employing silicon-based microscale devices, comprising microdroplet transport channels, reaction regions, electrophoresis modules, and radiation detectors. The discrete droplets are differentially heated and propelled through etched channels. Electronic components are fabricated on the same substrate material, allowing sensors and controlling circuitry to be incorporated in the same device.

REFERENCES:
patent: 6575188 (2003-06-01), Parunak
patent: 6679279 (2004-01-01), Liu et al.
patent: 2002/0143437 (2002-10-01), Handique et al.
patent: 2004/0007275 (2004-01-01), Liu et al.

Affiliated with

Also associated with

Rating

Thermal micro-valves for micro-integrated devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal micro-valves for micro-integrated devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal micro-valves for micro-integrated devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3737114