Measuring and testing – Volume or rate of flow – Thermal type
Patent
1995-08-09
1997-08-12
Chilcot, Richard
Measuring and testing
Volume or rate of flow
Thermal type
G01F 168
Patent
active
056567731
ABSTRACT:
A thermal micro flow sensor including a heating wire, said heating wire being made of a material having a resistivity in the range from 3.1.times.10.sup.-7 .OMEGA.m to 2.times.10.sup.-2 .OMEGA.m like polysilicon so that said heating wire has a resistance about 1 k.OMEGA., said heating wire being formed on a semiconductor material so that said heating wire has a thermal isolation structure for isolating said heating wire from said semiconductor substrate.
REFERENCES:
patent: 4009482 (1977-02-01), Nakata
patent: 4293373 (1981-10-01), Greenwood
patent: 4320655 (1982-03-01), Kammermaier et al.
patent: 4343768 (1982-08-01), Kimura
patent: 4377944 (1983-03-01), Hishii et al.
patent: 4471647 (1984-09-01), Jerman et al.
patent: 4624137 (1986-11-01), Johnson et al.
patent: 4696188 (1987-09-01), Higashi
patent: 4759836 (1988-07-01), Hill et al.
patent: 5050429 (1991-09-01), Nishimoto et al.
patent: 5148707 (1992-09-01), Inada et al.
patent: 5388457 (1995-02-01), Yasui
Artis Jewel V.
Chilcot Richard
Tokyo Gas Co. Ltd.
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