Thermal management systems for micro-components

Details Thermal management systems for micro-components Thermal management systems for micro-components

2006-03-28

2006-03-28

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C257S714000, C361S701000

Reexamination Certificate

active

07019971

ABSTRACT:
Apparatus and methods for providing self-contained, closed-loop microchannel cooling systems that can be integrated into a micro-component package, such as a microelectronic package, are described herein.

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