Thermal management system having a thermally conductive sheet an

Details Thermal management system having a thermally conductive sheet an Thermal management system having a thermally conductive sheet an

1996-05-03

1997-08-26

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361699, 361700, 16510426, 16510433, 174 152, H05K 720, G06F 120

Patent

active

056616376

ABSTRACT:
A thermal management system having an enclosure comprising a pair of enclosure regions disposed on opposite surfaces of a flexible thermally conductive sheet. The enclosure regions are coupled together through an aperture provided in the sheet. A liquid transporting material is disposed within the enclosure and passes between the enclosure regions through the aperture. A liquid is disposed on the liquid transporting material. One end portion of the thermally conductive sheet is adapted for thermal coupling to a heat source and the opposite end portion is adapted for thermal coupling to a heat sink. Heat emanating from the heat source passes though the thermally conductive sheet to the liquid to convert the liquid to a vapor. The vapor passes within, and through, the enclosure regions for transportation to the end of the liquid transporting material disposed adjacent the heat sink coupling end of the thermally conductive material. The transported vapor is condensed to the liquid as the vapor transfers its heat through the thermally conductive sheet to the heat sink. The condensed liquid is then transported by capillary action provided by the liquid transporting material back to the other end thereof to complete one of a series of continuously repeating heat transfer cycles.

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patent: 5383340 (1995-01-01), Larson et al.
patent: 5409055 (1995-04-01), Tanaka et al.
patent: 5560423 (1996-10-01), Larson et al.

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