Thermal management system for evaporative spray cooling

Details Thermal management system for evaporative spray cooling Thermal management system for evaporative spray cooling

2002-09-27

2010-11-23

Ali, Mohammad M (Department: 3744)

Refrigeration

Processes

Treating an article

C062S259400

Reexamination Certificate

active

07836706

ABSTRACT:
A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.

REFERENCES:
patent: 3083547 (1963-04-01), Stevens et al.
patent: 4399484 (1983-08-01), Mayer
patent: 4494594 (1985-01-01), Kurzinski
patent: 4706480 (1987-11-01), Svatos
patent: 4846675 (1989-07-01), Soliman
patent: 4940558 (1990-07-01), Jarboe et al.
patent: 5021924 (1991-06-01), Kieda et al.
patent: 5168348 (1992-12-01), Chu et al.
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5311931 (1994-05-01), Lee
patent: 5349831 (1994-09-01), Daikoku et al.
patent: 5438477 (1995-08-01), Pasch
patent: 5508884 (1996-04-01), Brunet et al.
patent: 5516884 (1996-05-01), Bianconi
patent: 5548612 (1996-08-01), Matsuo et al.
patent: 5675473 (1997-10-01), McDunn et al.
patent: 5687577 (1997-11-01), Ballard et al.
patent: 5718117 (1998-02-01), McDunn et al.
patent: 5719444 (1998-02-01), Tilton et al.
patent: 5746585 (1998-05-01), McDunn et al.
patent: 5761035 (1998-06-01), Beise
patent: 5768103 (1998-06-01), Kobrinetz et al.
patent: 5818692 (1998-10-01), Denney, Jr. et al.
patent: 5831324 (1998-11-01), Bang
patent: 5841564 (1998-11-01), McDunn et al.
patent: 5860602 (1999-01-01), Tilton et al.
patent: 5879503 (1999-03-01), McDunn et al.
patent: 5880931 (1999-03-01), Tilton et al.
patent: 5907473 (1999-05-01), Przilas et al.
patent: 5924482 (1999-07-01), Edwards et al.
patent: 5933700 (1999-08-01), Tilton
patent: 5937937 (1999-08-01), Sehmbey et al.
patent: 5943211 (1999-08-01), Havey et al.
patent: 6014238 (2000-01-01), McDunn et al.
patent: 6016969 (2000-01-01), Tilton et al.
patent: 6054095 (2000-04-01), Minato et al.
patent: 6060966 (2000-05-01), Tennant et al.
patent: 6064572 (2000-05-01), Remsburg
patent: 6108201 (2000-08-01), Tilton et al.
patent: 6115251 (2000-09-01), Patel et al.
patent: 6134108 (2000-10-01), Patel et al.
patent: 6178766 (2001-01-01), Tong et al.
patent: 6205799 (2001-03-01), Patel et al.
patent: 6292364 (2001-09-01), Fitzgerald et al.
patent: 6300167 (2001-10-01), Raleigh et al.
patent: 6308771 (2001-10-01), Tavassoli
patent: 6349554 (2002-02-01), Patel et al.
patent: 6362956 (2002-03-01), Heirich et al.
patent: 6377453 (2002-04-01), Belady
patent: 6377458 (2002-04-01), Morris et al.
patent: 6457321 (2002-10-01), Patel et al.
patent: 6467278 (2002-10-01), Hu et al.
patent: 6484521 (2002-11-01), Patel et al.
patent: 6571569 (2003-06-01), Rini et al.
patent: 6595014 (2003-07-01), Malone et al.
patent: 6688381 (2004-02-01), Pence et al.
patent: 6706402 (2004-03-01), Rueckes et al.
patent: 6775997 (2004-08-01), Bash et al.
patent: 2001/0002541 (2001-06-01), Patel et al.
patent: 2002/0011249 (2002-01-01), Augustine et al.
patent: 2002/0050144 (2002-05-01), Patel et al.
patent: 2002/0075650 (2002-06-01), Morris et al.
patent: 2002/0112496 (2002-08-01), Bash et al.
patent: 2002/0112498 (2002-08-01), Bash et al.
patent: 2002/0113141 (2002-08-01), Malone et al.
patent: 2002/0113142 (2002-08-01), Patel et al.
patent: 2002/0114139 (2002-08-01), Bash et al.
patent: 2002/0114140 (2002-08-01), Bash et al.
patent: 2002/0135981 (2002-09-01), Pautsch
patent: 0429188 (1991-05-01), None
patent: DE003132112 (1982-03-01), None
patent: 57-161023 (1982-10-01), None
Abstract of JP 57-161023 A to Fujikake et al.
Tilton, Donald E., “Spray Cooling” PhD dissertation, University of Kentucky, 1989.
Tilton, Donald E., Ambrose, Jay H., “Closed-System, High-Flux Evaporative Spray Cooling”. Final Report, Air Force contract F33615-88-C-2860, 1989.
Donald E. Tilton, Charles L. Tilton, Clifford J. Moore, and Randy E. Ackerman, “Spray Cooling for the 3-D Cube Computer”. 1994 InterSociety Conference on thermal Phenomena, pp. 169-176.
Tilton, D.E., tilton, Cl., Pais, M.R., and Chow, L.C., “Spray Cooling of simulated Electronic Chips in a Compact Package”, Final Report, Air Force Contract F33615-89-C-2972, Oct. 1991.
Pais, M.R., tilton, D.E., Chow, Lc. And Maheficey, E.t., “High-Heat-Flux, Low-Superheat Evaporative Spray Cooling”, AIAA Paper AIRR-89-024 1, 27th Aerospace Sciences Meeting, Reno, Nevada, 1939.
Tilton, D.E., Ambrose, J.H., and Chow, L.C., “Closed-System, High-Flux Evaporative Spray Cooling”, SAE Paper 892316, Aerotech 89, Anneheim, CA.
Tilton, D.E., Tilton, C.L. Pais, M.R., and Morgan, M.J., “High-Flux Spray Cooling in a Simulated Multichip Module”, ASME 1992 National Heat Transfer Conference, Aug. 9-12, San Diego, CA.
Marcos,A ., Chow, L., Du, Jian-Hua, Rini, D., Lindauer, J., “Spray Cooling at Low System Pressure”, pp. 169-175, 18th IEEE.SEMI-THERM Symposium, 2002.
Tilton, Donald, “High Performance COTS DSP for Harsh Environments”, COTS Journal, May/Jun. 1999.
Tilton, Donald E. And Kehret, William E., “Mist Cooling for Harsh Environment VME Electronics”, RTC Magazine, May 1999.
Tilton, Donald, Partha, Arjun, and Borchelt, Fred, “Advanced Thermal Management for Multichip Modules”, Electronic Packaging & Production, Aug. 1995.
Smetana, Bruce A. and Venkataramanan, Ph.D., Girl, Montana State University, “Advanced Thermal Management for High Density Distributed Power Systems”. HFPC Conference, May 7-11, 1995.
Tilton, Donald E., Tilton, Charles L., Moore, Clifford J., Ackerman, Randy E., “Spray Cooling for the 3-D Cube Computer”, InterSociety Conference on thermal Phenomena in Electronic systems, I-THERM IV, Washington DC, May 4-7, 1994.
Tilton, Donald E., Kearns, Donald A., Tilton, Charles L., “Liquid Nitrogen Spray Cooling of a Simulated Electronic Chip”, Proceedings of the 1993 Cryogenic Engineering Conference, Albuquerque, New Mexico, Jul. 12-16, 1993.
Tilton, D.E., Tilton, C.L., Pais, M.R. And Chow, L.C., “Spray Cooling of Simulated Electronic Chips in a Compact package”, Final Report, Air Force Contract F33615-89-C-2972, Oct. 1991.
Tilton, D.E., Chow, L.C., Mahefkey, E.T. And Switzer, G., “Critical Heat Flux Phenomena in Spray Cooling”, AIAA Paper 90-1729, AIAA/ASME 5th Joint Thermophysics and Heat Transfer Conf., Seattle. WA, Jun. 18-20, 1990, also to appear AIAA Journal of Thermophysics and Heat Transfer.
Tilton, D.E., Ambrose. J.H., and Chow, L.C., “Closed-System, High-Flux Evaporative Spray Cooling”, SAE Paper 892316, Aerotech 89, Anneheim, CA.
Pais, M.R., Tilton, D.E., Chow, L.C. and Mahefkey, E.T.. “High-Heat-flux, Low-Superheat Evaporative Spray Cooling”. AIAA Paper AIRR-89-0241, 27th Aerospace Sciences Meeting, Reno. Nevada, 1989.
Boudreaux, P.J., Tilton, D.E., Appel. P.W., “Spray Cooling Microelectronics”, IEEE International Physics Symposium, Orlando, FA. Apr. 30-May 3, 2001.
Websites: http://www.spraycool.com: http://www.navysbir.brtrc.com/SuccessStories/lsothermalSystems.pdf.
AIAA-87-1536 “High Power Density Evaperative Cooling”. D.E. Tilton, L.C. Chow, Univ. of Kentucky, Lexington, KY; and E.T. Mahefkey, Aero Propulsion Lab., Wright-Patterson AFB, OH.
“Thermal Management of Multichip Modules with Evaporative Spray Cooling”, EEP vol. 26-2, Advances in Electronic Packaging - 1999, vol. 2, ASME 1999.
“Effects of Surface Roughness on Water Droplet Impact History and Heat Transfer Regimes” vol. 40, No. 1, pp. 73-88, 1997, Copyright 1996 Elsevier Science Ltd. John D. Bernardin, Clinton J. Stebbins and Issam Mudawar.
“Surface Roughness and its Effects on the Heat Transfer Mechanism in Spray Cooling”, M. R. Pais and L. C. Chow, Dept. of Mechanical Engineering, University of Kentucky, Lexington KY 40506, ASME Winter Annual Meeting, San Francisco, CA Dec. 1989.

Affiliated with

Also associated with

Rating

Thermal management system for evaporative spray cooling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal management system for evaporative spray cooling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal management system for evaporative spray cooling will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4251519