Thermal management system and method for electronic assemblies

Details Thermal management system and method for electronic assemblies Thermal management system and method for electronic assemblies

2007-11-06

2007-11-06

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C165S104330, C361S699000, C361S702000

Reexamination Certificate

active

11039212

ABSTRACT:
According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a coldplate, a spring member disposed between and engaging both the electronic component and the coldplate, and a heat transfer element disposed within a chamber formed by the spring member.

REFERENCES:
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4951740 (1990-08-01), Peterson et al.
patent: 5198889 (1993-03-01), Hisano et al.
patent: 5206791 (1993-04-01), Novotny
patent: 5608610 (1997-03-01), Brzezinski
patent: 6918437 (2005-07-01), Eytcheson et al.

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