Thermal management system and method for electronic...

Details Thermal management system and method for electronic... Thermal management system and method for electronic...

2006-01-24

2006-01-24

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S711000, C257S712000, C257S714000, C174S015100, C165S080400

Reexamination Certificate

active

06989991

ABSTRACT:
According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

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John Patrick O'Connor, “Reducing Surface Temperature Gradients by Tailoring Convective Film Coeeficients”, Advancing Microelectronics, vol. 28, No. 2, Mar./Apr. 2001 (http://www.imaps.org/adv—micro/2001mar—apr/2.html).

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