Thermal management system

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S708000, C361S799000, C165S080200

Reexamination Certificate

active

06972953

ABSTRACT:
An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.

REFERENCES:
patent: 3407869 (1968-10-01), Staunton
patent: 4241380 (1980-12-01), Lehmann et al.
patent: 4519016 (1985-05-01), Bradley et al.
patent: 4850657 (1989-07-01), Placke et al.
patent: 5237486 (1993-08-01), LaPointe et al.
patent: 5243493 (1993-09-01), Jeng et al.
patent: 5272593 (1993-12-01), Jakob et al.
patent: 5297025 (1994-03-01), Shouquist et al.
patent: 5313362 (1994-05-01), Hatada et al.
patent: 5557500 (1996-09-01), Baucom et al.
patent: 5559675 (1996-09-01), Hsieh et al.
patent: 5600538 (1997-02-01), Xanthopoulos
patent: 5612852 (1997-03-01), Leverault et al.
patent: 5661630 (1997-08-01), Levins et al.
patent: 5671120 (1997-09-01), Kikinisi
patent: 5677830 (1997-10-01), Nogus et al.
patent: 5726864 (1998-03-01), Copeland et al.
patent: 5751550 (1998-05-01), Korinsky
patent: 5774330 (1998-06-01), Melton et al.
patent: 5784256 (1998-07-01), Nakamura et al.
patent: 5812373 (1998-09-01), Hwang
patent: 5813243 (1998-09-01), Johnson et al.
patent: 5816673 (1998-10-01), Sauer et al.
patent: 5835343 (1998-11-01), Johns et al.
patent: 5870485 (1999-02-01), Lundgren et al.
patent: 5923531 (1999-07-01), Bachman et al.
patent: 5963424 (1999-10-01), Hileman et al.
patent: 5973920 (1999-10-01), Altic et al.
patent: 6008986 (1999-12-01), Mok
patent: 6015195 (2000-01-01), Anderson et al.
patent: 6028769 (2000-02-01), Zurek
patent: 6049455 (2000-04-01), Nakamura et al.
patent: 6101089 (2000-08-01), Seto
patent: 6104451 (2000-08-01), Matsuoka et al.
patent: 6115249 (2000-09-01), Cipolla et al.
Article “Personal Computer Structure Designed for Robotized Manufacturability”, IBM Technical Disclosure Bulletin, Aug. 1987, US, vol. 30, Issue 3, pp. 1253-1255.

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