Heat exchange – Heat transmitter
Reexamination Certificate
1999-08-16
2001-07-10
Flanigan, Allen (Department: 3743)
Heat exchange
Heat transmitter
C174S252000, C361S704000
Reexamination Certificate
active
06257329
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the field of thermal conductive devices, and more particularly to a novel highly efficient thermal conducting device capable of conducting thermal energy from a heat source to a dissipating means or to a means which can utilize the biproduct heat generated by the source.
2. Brief Description of the Prior Art
In the past, it has been the conventional practice to dissipate heat by placing a series of heat conductive plates in close spaced-apart relationship and placing this assembly into close proximity to a heat source so that the heat is absorbed by the plates and dissipated into the surrounding air or environment. Other forms of handling heat dissipating revolve around liquid conduction systems which may include coils such as are used in heat exchangers or the like. However, problems and difficulties have been encountered when using conventional heat sinks, thermal dissipation means or the like, which stem largely from that fact that the dissipated heat is lost and no useful production or advantage is taken. No means is provided for tapping or extracting the heat prior to dissipation so that it may be transported or conducted to a remote location where it can be used for operation or to advantage of other devices. Also, problems have been encountered with adjacent materials to a heat source relating to co-efficience of expansion. For example, “Kovar” chips employed in modern circuitry encounter severe thermal problems which limit their reliability and the term of operation when such material is used as a di-electric/material matrix material. Such interface has little or no coefficiency of expansion compatibility which is limiting in efficiency--and reliability of components.
A further problem in convention heat sinks or the like is the inability to flex or conduct thermal energy over an elongated expanse. Heat sinks are not known which are flexible so as to reduce the area or space in which heat sinks are normally installed. No means is employed in conventional heat sinks for tapping into the accumulated heat preparatory for dissipation so that the accumulated heat can be transferred or conducted to other devices for useful purposes.
Therefore, a long-standing need has existed to provide a novel thermal management system which includes a heat carrier composed of a graphite substance capable of carrying thermal energy from a heat source to an area where it is either dissipated or used for alternate purposes. The thermal management device or system includes a thermal conductive system especially applied to high speed and power electronic systems requiring efficiency and reliability of operation not only in the collection and dissipation or dispersion of heat but in associated components in an electrical circuit.
SUMMARY OF THE INVENTION
Accordingly, the above problems and difficulties are avoided by the present invention which provides a thermal management system including a compressed and heat treated graphite material layer laminated between two layers of thin insulated layers providing an integral and unitary construction. Heat generating components are mounted on either or both insulation layers and openings or “windows” are selectively placed in the insulation layer immediately adjacent to each heat generating component and each opening is occupied by graphic material connecting with the runs of graphite material sandwiched between the insulated layers. Thereby, heat generated by the component is carried by the graphite connector between layers to the graphite layer for transfer and connection away from the component.
The graphite material layers serve as thermal bus lines and are designed into a suitable geometric configuration so as to extend or run between additional components. The graphite material runs or strips terminate in a remote dissipation means or in a thermal utilization means. Intermediate flexible heat transfer runs may extend between rigid runs or paths of the graphite material and the dissipation or utilization means. Thereby, the thermal management system includes both rigid and flexible laminated graphite material layers arranged in suitable geographic configurations so as to connect heat generating sources or components with the ultimate dissipation or utilization means.
The interconnecting thermal conducting graphite layers between the components and the dissipation or utilization means may include taps or interconnection points for interconnecting various runs of the graphite material.
Therefore, it is among the primary objects of the present invention to provide a novel thermal management system which employs graphite which has been compressed and heat treated so as to provide elongated, interlinked, molecular crystallization runs or paths which carry thermal energy from a heat source such as an electrical component to a dissipation or utilization means.
Still a further object of the present invention is to provide a novel heat management system having a graphite layer laminated between two insulated layers having a formal reflow after cure which far exceeds the graphite's thermal carrying temperature.
Yet another object resides in a thermal management system employing a run or elongated path of graphite material which conducts heat at five times that of copper and at half the weight of aluminum.
Still a further object resides in a thermal management system wherein graphite layers or paths after heat treating and encapsulation interfaces with a plurality of dielectric/metal matrix material with little or no coefficient of expansion.
A further object resides in a thermal management system which can be specifically applied to high speed and power electronic systems requiring the removal of excess heat and that will conduct and transfer the heat to a remote location for introduction to either a heat dissipating means or for usage in a useful device or equipment.
REFERENCES:
patent: 4495378 (1985-01-01), Dotzer et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 5077637 (1991-12-01), Martorana et al.
patent: 5386339 (1995-01-01), Polinski, Sr.
patent: 5542022 (1996-07-01), Zauderer
patent: 5787713 (1998-08-01), Russo
patent: 5927094 (1999-07-01), Nickum
patent: 5949650 (1998-09-01), Bulante et al.
Flanigan Allen
Marrs Roger A.
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