Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-11
2007-09-11
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S185000, C257S707000, C257S713000, C361S707000
Reexamination Certificate
active
10904631
ABSTRACT:
A circuit board assembly with a substrate having a laminate construction of ceramic layers, such as an LTCC ceramic substrate. The substrate is configured for the purpose of improving the thermal management of power circuit devices mounted to the substrate. Thermally-conductive vias extend through the substrate from a first surface thereof to a second surface thereof. A circuit device is mounted to the first surface of the substrate and is electrically interconnected to conductor lines of the substrate. The device is also thermally coupled to the thermally-conductive vias with a first solder material. A heat sink located adjacent the second surface of the substrate is bonded to the thermally-conductive vias with a second solder material, such that the first solder material, the thermally-conductive vias, and the second solder material define a thermal path from the device to the heat sink.
REFERENCES:
patent: 5113315 (1992-05-01), Capp. et al.
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 5721454 (1998-02-01), Palmer
patent: 5896271 (1999-04-01), Jensen et al.
patent: 5909085 (1999-06-01), Nelson
patent: 5990550 (1999-11-01), Umezawa
patent: 6058013 (2000-05-01), Christopher et al.
patent: 6212076 (2001-04-01), MacQuarrie et al.
patent: 6219243 (2001-04-01), Ma et al.
patent: 6226183 (2001-05-01), Weber et al.
patent: 6282094 (2001-08-01), Lo et al.
patent: 6477054 (2002-11-01), Hagerup
patent: 6525942 (2003-02-01), Huang et al.
patent: 7084511 (2006-08-01), Matsuda
patent: 7138711 (2006-11-01), Yee et al.
patent: 2002/0034066 (2002-03-01), Huang et al.
patent: 2002/0057558 (2002-05-01), Barrow
patent: 2004/0037044 (2004-02-01), Cook et al.
patent: 2004/0196635 (2004-10-01), Park et al.
patent: 2003/291243 (2004-06-01), None
patent: 19910500 (2000-10-01), None
patent: 0871352 (1998-10-01), None
EP Search Report dated Aug. 18, 2006.
Berlin Carl W.
Myers Bruce A.
Sarma Dwadasi Hara Rama
Delphi Technologies Inc.
Funke Jimmy L.
Thompson Gregory D
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