Thermal management of surface-mount circuit devices

Details Thermal management of surface-mount circuit devices Thermal management of surface-mount circuit devices

2008-04-29

2008-04-29

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S548000, C361S761000

Reexamination Certificate

active

10904904

ABSTRACT:
A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first surface of the substrate, and a cavity is defined by and between the heat sink and the substrate such that a base wall of the cavity is defined by one of the layers with conductor lines thereof being present on the base wall. A surface-mount circuit device is received within the cavity, mounted to the base wall, and electrically connected to the conductor lines on the base wall. The device is received within the cavity such that a surface of the device contacts a surface region of the heat sink. The surface of the device is bonded to the surface region of the heat sink to provide a substantially direct thermal path from the device to the heat sink.

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