Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-02-08
2005-02-08
Nelms, David (Department: 2818)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S690000, C257S723000, C257S724000, C361S704000, C361S785000, C361S803000
Reexamination Certificate
active
06853559
ABSTRACT:
A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The power reservoir is integrated into a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least one opening that opens up to a operational surface of the integrated circuit. A heat-dissapating device, such as a finned heat sink or the like is supported by the cover member and extends through its opening into contact with a heat-generating surface of the integrated circuit to cool it during operation.
REFERENCES:
patent: 4734819 (1988-03-01), Hernandez et al.
patent: 5103283 (1992-04-01), Hite
patent: 5272590 (1993-12-01), Hernandez
patent: 5306948 (1994-04-01), Yamada et al.
patent: 5403195 (1995-04-01), Thrush et al.
patent: 5403784 (1995-04-01), Hashemi et al.
patent: 5438481 (1995-08-01), Murphy et al.
patent: 5481436 (1996-01-01), Werther
patent: 5483099 (1996-01-01), Natarajan et al.
patent: 5694297 (1997-12-01), Smith et al.
patent: 5717249 (1998-02-01), Yoshikawa et al.
patent: 5734555 (1998-03-01), McMahon
patent: 5747875 (1998-05-01), Oshima
patent: 5831810 (1998-11-01), Bird et al.
patent: 5844419 (1998-12-01), Akram et al.
patent: 5892275 (1999-04-01), McMahon
patent: 5895966 (1999-04-01), Penchuk
patent: 5956576 (1999-09-01), Toy et al.
patent: 6046911 (2000-04-01), Dranchak et al.
patent: 6081426 (2000-06-01), Takeda et al.
patent: 6271607 (2001-08-01), Vandenbossche
patent: 6469895 (2002-10-01), Smith et al.
patent: 6558181 (2003-05-01), Chung et al.
patent: 6678168 (2004-01-01), Kenny et al.
patent: 20030193791 (2003-10-01), Panella et al.
patent: 20030194832 (2003-10-01), Lopata et al.
patent: 20030202330 (2003-10-01), Lopata et al.
patent: WO 8905570 (1989-06-01), None
patent: WO 0165344 (2001-09-01), None
International Search Report for International Application No. PCT/US02/30591, Jan. 2, 2003.
Dutta Arindum
McGrath James L.
Panella Augusto P.
Molex Incorporated
Nelms David
Nguyen Dao H.
Paulius Thomas D.
LandOfFree
Thermal management of power delivery systems for integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal management of power delivery systems for integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal management of power delivery systems for integrated... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3505113