Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-01
2011-03-01
Abrams, Neil (Department: 2839)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
07898811
ABSTRACT:
A light emitting diode (LED) lighting assembly includes a printed circuit board that includes a dielectric layer sandwiched between first conductive layers. The printed circuit board includes vias extending there through, with thermally conductive plugs in the vias. A second conductive layer is on each first conductive layer and on the thermally conductive plugs. The thermally conductive plugs are enclosed by the second conductive layers. LEDs are coupled to the printed circuit board, with each LED being mounted over at least one thermally conductive plug to dissipate heat therefrom.
REFERENCES:
patent: 5113315 (1992-05-01), Capp. et al.
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 6045240 (2000-04-01), Hochstein
patent: 6212076 (2001-04-01), MacQuarrie et al.
patent: 6428189 (2002-08-01), Hochstein
patent: 6498355 (2002-12-01), Harrah et al.
patent: 6920046 (2005-07-01), Spryshak
patent: 6966674 (2005-11-01), Tsai
patent: 6999318 (2006-02-01), Newby
patent: 7054159 (2006-05-01), Nakamura
patent: 7532479 (2009-05-01), Ohno et al.
patent: 7538424 (2009-05-01), Mullen et al.
patent: 2004/0184272 (2004-09-01), Wright et al.
patent: 2004/0203189 (2004-10-01), Chen et al.
patent: 2006/0023448 (2006-02-01), Mok et al.
patent: 2006/0049475 (2006-03-01), Wang et al.
patent: 2006/0098438 (2006-05-01), Ouderkirk et al.
patent: 2006/0181878 (2006-08-01), Burkholder
patent: 2006/0278885 (2006-12-01), Tain et al.
patent: 2007/0057364 (2007-03-01), Wang et al.
patent: 2007/0080360 (2007-04-01), Mirsky et al.
patent: 2007/0081340 (2007-04-01), Chung et al.
patent: 2007/0081342 (2007-04-01), Szeto
Abrams Neil
Allen Dyer Doppelt Milbrath & Gilchrist, P.A.
Raled, Inc.
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