Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-05-31
2011-05-31
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S629000, C438S667000, C257SE23145
Reexamination Certificate
active
07951650
ABSTRACT:
Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.
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Co-pending U.S. Appl. No. 11/363,095, filed Feb. 28, 2006, David J. Lima, entitled “Thermal Management of Electronic Devices”.
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Harrity & Harrity LLP
Juniper Networks, Inc.
Parekh Nitin
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