Thermal management of electronic components using synthetic diam

Details Thermal management of electronic components using synthetic diam Thermal management of electronic components using synthetic diam

1995-05-17

1997-07-15

Turner, Archene

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428209, 428408, 428216, 174138C, 257 77, H01L 2980

Patent

active

056481489

ABSTRACT:
A heat-sinked electronic component includes a first layer of synthetic diamond having a relatively low thermal conductivity. A second layer of synthetic diamond is adjacent the first layer, the second layer of synthetic diamond having a relatively high thermal conductivity, the second layer being thinner than the first layer. An electronic component is mounted on the second layer of synthetic diamond. In a disclosed embodiment, the thermal conductivity of the diamond of the second layer is at least fifteen percent higher than the thermal conductivity of the diamond of the first layer, and the first layer is at least twice as thick as second layer.

REFERENCES:
patent: 4471003 (1984-09-01), Cann
patent: 4487162 (1984-12-01), Cann
patent: 4707384 (1987-11-01), Schachner et al.
patent: 4900628 (1990-02-01), Ikegaya et al.
patent: 4987002 (1991-01-01), Sakamoto et al.
patent: 4988421 (1991-01-01), Drawl et al.
patent: 5006203 (1991-04-01), Purdes
patent: 5110579 (1992-05-01), Anthony et al.
patent: 5114696 (1992-05-01), Purdes
patent: 5114745 (1992-05-01), Jones
patent: 5124179 (1992-06-01), Garg et al.
patent: 5131963 (1992-07-01), Ravi
patent: 5139372 (1992-08-01), Tanabe et al.
patent: 5144380 (1992-09-01), Kimoto et al.
patent: 5204144 (1993-04-01), Cann et al.
patent: 5224969 (1993-07-01), Chen et al.
patent: 5260106 (1993-11-01), Kawarada et al.
patent: 5270077 (1993-12-01), Knemeyer et al.
patent: 5272104 (1993-12-01), Schrantz et al.
patent: 5294381 (1994-03-01), Iguchi et al.
patent: 5310512 (1994-05-01), Bigelow
patent: 5314652 (1994-05-01), Simpson et al.
patent: 5529846 (1996-06-01), Hayashi et al.

Affiliated with

Also associated with

Rating

Thermal management of electronic components using synthetic diam does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal management of electronic components using synthetic diam, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal management of electronic components using synthetic diam will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1491250