Thermal management for shielded circuit packs

Details Thermal management for shielded circuit packs Thermal management for shielded circuit packs

2007-08-07

2007-08-07

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C165S080300, C165S185000, C257S712000

Reexamination Certificate

active

11013054

ABSTRACT:
A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components) are cooled by individual heat sinks (i.e., each component has its own individual heat sink) which protrude into an external airflow through individual openings in the lid of the EMI shield. Mechanically-compliant, electrically-conductive gaskets are used to seal the base plates of the individual heat sinks against the lid of the EMI shield enclosure. As such, in accordance with the various embodiments, the conductive gaskets establish a compliance layer which accommodates any variation in the heights of the individual components, thereby, allowing optimum thermal contact between the components and their respective heat sinks without compromising the EMI shielding.

REFERENCES:
patent: 5910524 (1999-06-01), Kalinoski
patent: 6065530 (2000-05-01), Austin et al.
patent: 6075205 (2000-06-01), Zhang
patent: 6084178 (2000-07-01), Cromwell
patent: 6396701 (2002-05-01), Nakamura et al.
patent: 6707675 (2004-03-01), Barsun et al.
patent: 6744640 (2004-06-01), Reis et al.
patent: 6816376 (2004-11-01), Bright et al.
Kolodner, P. et al., “Efficient Cooling of Multiple Components in a Shielded Circuit Pack,” Proceedings of IPACK2005: InterPACK '05, 8 pages, Jul. 17-22, San Francisco, CA.

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