Thermal management for hot-swappable module

Details Thermal management for hot-swappable module Thermal management for hot-swappable module

2007-07-24

2007-07-24

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S719000, C174S016100, C165S080200, C165S080300

Reexamination Certificate

active

11092358

ABSTRACT:
A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

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Advanced TCA, PICMG 3.0 Short Form Specification, PCI Industrial Computers Manufacturers Group (PICMG), (Jan. 2003), 33 pages.
AMC PICMG AMC.0, Advanced Mezzanine Card Short Form Specification, Version D0.9a, (Jun. 15, 2004), 57 pages.

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