Thermal management device attachment

Details Thermal management device attachment Thermal management device attachment

2005-11-03

2009-06-23

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S709000, C165S080300, C165S185000

Reexamination Certificate

active

07551446

ABSTRACT:
A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

REFERENCES:
patent: 6519153 (2003-02-01), Shia et al.
patent: 6618251 (2003-09-01), Ishimine
patent: 6867975 (2005-03-01), Kashiwagi
patent: 7360586 (2008-04-01), Mania et al.
patent: 2005/0022970 (2005-02-01), Mania et al.
PCI Industrial Computers: Advanced TCA. PICMG 3.0 Short Form Specification, Jan. 2003. 34 pgs.
AMC: PICMG AMC.0. Advanced Mezzanine Card Short Form Specification. Jun. 15, 2004. 58 pgs.
“Intel Pentium M Processor with 2-MB L2 Cache and 533-MHz System Bus for Embedded Applications”,Thermal Design Guide; Feb. 2005, 39 Pages.

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