Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-12-04
2008-11-11
Chervinsky, Boris L. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S719000, C165S080300, C165S287000
Reexamination Certificate
active
07450381
ABSTRACT:
An apparatus, system, and method for managing cooling within a printed circuit board (PCB) enclosure. The system includes a PCB having a first surface on which electronic components are mounted. Multiple contour control actuators are fixedly disposed in a substantially planar array in z-axis opposition to the first surface of the PCB. Each of the contour control actuators has an extensible end that is electromechanically extendable in parallel with the z-axis normal to the first surface of the PCB. A substantially flexible sheet member is disposed between the extensible ends of the contour control actuators and the first surface of the PCB. The extensible ends contact the flexible sheet member such that the z-axis contour of the flexible sheet member is determined by the z-axis positions of the extensible ends. A contour controller adjusts the z-axis contour of the flexible sheet member by adjusting the relative positions of the extensible ends of one or more of the contour control actuators. The contour controller adjusts the relative positions of the extensible ends in accordance with thermal conditions proximate to the PCB.
REFERENCES:
patent: 4399484 (1983-08-01), Mayer
patent: 4583056 (1986-04-01), Takeda et al.
patent: 5563768 (1996-10-01), Perdue
patent: 5712762 (1998-01-01), Webb
patent: 5724229 (1998-03-01), Tustaniwskyi et al.
patent: 6736192 (2004-05-01), Chang
patent: 7170745 (2007-01-01), Bash et al.
patent: 7233493 (2007-06-01), Wang et al.
patent: 7262964 (2007-08-01), Barsun
patent: 2005/0035684 (2005-02-01), Fuse et al.
patent: 2006/0034051 (2006-02-01), Wang et al.
Gilliland Don A.
Huettner Cary M.
Wurth Dennis J.
Chervinsky Boris L.
Dillon & Yudell LLP
International Business Machines - Corporation
Smith Courtney L
LandOfFree
Thermal management apparatus and method for printed circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal management apparatus and method for printed circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal management apparatus and method for printed circuit... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4038812