Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-03-07
2009-11-24
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S708000, C257S707000, C174S252000
Reexamination Certificate
active
07623349
ABSTRACT:
The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a circuit assembly having a first thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to one or more heat generating components of the circuit substrate. The apparatus and method includes a second thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to the first thermally conductive layer. The first thermally conductive layer and the thermally conductive layer can be shaped, sized, and/or configured to provide cooling of the one or more heat generating components disposed on each side of the circuit substrate by transferring and spreading the heat to the outside of the circuit assembly.
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Fung Adrian
Refai-Ahmed Gamal
Shaw John
ATI Technologies ULC
Gandhi Jayprakash N
Smith Courtney
Vedder Price P.C.
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